APC Conference XXX 2018

Announcements

AM TUTORIAL: Machine Learning, Deep Learning –
                          Artificial Intelligence for the Semiconductor Industry
                          Instructor: Jim Redman, ErgoTech

Tuesday Keynote: Chris Maloney (Intel)

Advanced Process Control (APC) Systems are becoming increasingly critical in semiconductor manufacturing and the ongoing pursuit of Moore’s Law. As dimensions get smaller with each technology node, the tolerance for variability also decreases. Process targets are tight, and the tools are operating on the edge of their capability. When the process tools are not able to achieve the process targets on their own, we turn to APC to compensate for incoming variability, environmental changes, and process shifts. APC has become so integral to semiconductor manufacturing that when the APC systems go down, the fab goes down. The APC system is extremely dynamic and responsive, responding and adjusting to every variation in real time. Any interruption in that flow can have catastrophic consequences to the current operation and every downstream operation. In this talk we will cover how APC grew from a niche solution to an integral and pervasive part of semiconductor manufacturing during technology development as well as high volume manufacturing, and we will look at the challenges and opportunities for APC in future technology nodes.

Wednesday Keynote:  Joe Ervin (Lam Research/Coventor)

Joseph Ervin is director of the Semiconductor Process and Integration group at Coventor, where he is responsible for managing engineers who support customers of Coventor’s Virtual Fabrication platform. Previously, he worked for IBM on semiconductor device and integration development at multiple research and foundry locations, including ST Microelectronics, the College of Nanoscale Science and Engineering, and at GlobalFoundries. His current position includes work with next node semiconductor integration challenges, along with unique methods for modeling and solving these issues. He holds a Ph.D. in Device Physics from Arizona State University.

Call For Papers
As manufacturing processes become more complex with greater yield, quality and cost objectives, APC methods to increase productivity and quality become vital. These APC methods include traditional capabilities of diagnostics and process control, but also include emerging capabilities associated with the move to implement smart manufacturing and Industry 4.0 concepts; these extended APC capabilities include prediction technologies simulation and “digital twin”, and big data infrastructures. Semiconductor, memory, photovoltaic, display, MEMS, LED, pharmaceuticals, chemical and other industries are experiencing unparalleled cost and quality pressures. These demanding objectives have made APC absolutely critical for profitable manufacturing. The Integrated Measurement Association is pleased to again host this year’s conference and announce the APC Conference XXX Call for Papers.

This call for papers is directed to the microelectronics industry, but also to any discrete manufacturing industry that has similar requirements of productivity, quality and precision. Manufacturers, equipment suppliers, universities and research institutions, software solution providers, sensor, and metrology suppliers are all encouraged to submit abstracts. APC advancements in the semiconductor and related industries will be examined to assess how synergy between these industries can be better leveraged. The conference will focus on recent technical advancements, current challenges, and future needs and trends. 

Conference Topics
The conference will be built around topics such as, but not limited to:

• Run-to-run, wafer-to-wafer, model-based, and real-time process control
• Fault detection and classification (FDC), and fault prediction (FP)
• Predictive maintenance, predictive scheduling, predictive yield
• Virtual metrology, sensing and integrated metrology
• Simulation, emulation, and cyber-physical systems
• Big data analytics, data mining, Hadoop, and cloud-based systems
• Data collection and management, data quality
• Security such as in data sharing, partitioning and IP, conversion techniques, standards
• Analytics, analytics application, and digital thread
• Factory-wide and enterprise-wide applications and deployment
• Manufacturing Execution Systems (MESs) and their integration with APC
• Integration with yield, maintenance management, adaptive scheduling, DFM
• Sensor development, implementation, integration, remote/wireless networks
• Applications: Etch, litho, dep., implant, backend, solar, MEMS, PV, disk drive, pharma
• Future needs, requirements, roadmaps, Industry 4.0 and smart manufacturing
• Equipment productivity data collection/analysis
• APC-related solutions in other precision industries such as pharmaceutical and chemical
• APC and green technologies, environmental safety and health

Abstract Submission Rules and Procedures: By submitting an abstract you agree to be bound by the following rules and procedures:

• Submissions should consist of an informational page (title, authors, email), one or more pages for abstract text (motivation, approach, results), and one or more pages for figures, charts, data tables, and/or pictures.
• Abstracts must include a description of the Motivation for the work, a description of the Approach used, and a description of the Results. Abstracts and presentations must be technical in nature. Abstracts that are simple product descriptions or are commercially focused will be rejected. Abstracts marked confidential or proprietary will be rejected.
• Only MS Word and PDF file formats are acceptable. A link to the downloadable abstract submission form is below on this conference website.
• Abstracts must be in English. Text, tables and graphics must be embedded into a single file.
• Email your abstract to vaneck@APCconference.com
• Abstracts are used to determine which submissions will be accepted for oral or poster presentation. Accepted authors will be contacted by email
• All accepted abstract authors must submit both a PowerPoint file and a PDF file of their poster or oral presentation.
• Presenting authors (oral and poster) must register online for the APC Conference.
• The PowerPoint file will be used during oral presentation at the conference.
• The PDF version of the presentation (oral and poster) will be included in the conference proceedings.
• A suggested PowerPoint Poster template and an oral presentation PPT template, in 16:9 aspect ratio, are available for download, see links below.

Direct questions/inquiries to vaneck@APCconference.com.

Download Abstract Submission Form

Download Poster PPT Template

Download Presentation Template 16:9 Format

Download Call for Papers Document

Download Blank Publication Permission Form

Important Dates

Abstract Submission Deadline: August 10, 2018

Abstract Acceptance Notification: August 17, 2018

PowerPoint Presentation/Poster and PDF Deadline: September 14, 2018

Group Discounts
If your company anticipates sending 6 or more people to the APC Conference, send an email to vaneck@APCconference.com.  The IMA will consider group discounts. Click to send an email to the APC Conference organizers vaneck@apcconference.com

CONFERENCE ORGANIZATION

The APC Conference is co-chaired by:

Dr. James Moyne, University of Michigan, Applied Materials

John Pace, Integrated Measurement Association, President

Dr. Bradley Van Eck, Integrated Measurement Association, VP

The APC Conference is Underwritten and Organized by the Integrated Measurement Association

Related APC Links

APC Europe
http://www.apcm-europe.eu/home.html

APC Asia - Taiwan
http://www.tsia.org.tw/seminar/eManufacturing2018/

APC Asia - Japan
https://www.semiconportal.com/AECAPC/index_e.html