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APC Conference XXXI 2019
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  • Advanced Process Control Conference 2019
         

Technical Sessions Agenda 2019


 APC 2019 Technical Sessions Agenda (draft version as of October 22, 2019)

Tuesday, October 29, 2019 Tuesday, October 29, 2019

Majestic Ballroom A (Track A) Majestic Ballroom B (Track B)

Keynote Session
Chairs: John Pace, James Moyne, Bradley Van Eck
830am Welcome
845am KEYNOTE: Automotive Semiconductor ZERO DEFECT Enablement, Steve Frezon, NXP Semiconductors 19020
930am INVITED: Technology Scaling Through Radical Variation Reduction, Joe Ervin, Coventor (Lam Research) 19004
1000amNon Threaded Run-to-Run Control: Four Key Advantages for High-Mix Manufacturing, Richard Good, Dinesh Balasubramanian, Ian Krumanocker, GLOBALFOUNDRIES 19016
1030am Coffee Break Coffee Break
       Sponsored by    PEER Group Logo with Tagline copy
 

 SMART Manufacturing Session
Chairs: Michael McIntyre, Rudolph Technologies, Merritt Funk, Tokyo Electron America
 Fault Detection Session
Chairs: Alan Weber, Cimetrix, Richard Good, GLOBALFOUNDRIES
1100am A Comprehensive Digital Twin Framework for Semiconductor Manufacturing: Case Study - Optimized Scheduling/Dispatch, Yassine Qamsane, James Moyne, Dawn Tilbury, Kira Barton, University of Michigan 19030
 Wafer and lot level outlier detection in semiconductor manufacturing, Mohamed Boumerzoug, James Bird, NXP Semiconductors 19024
1130am Securing Data in a Paranoid Industry, Doug Suerich, PEER Group 19045
 A Pattern-based Trace Data Generator for Fault Detection of Wafer Fabrication Processes, Haoshu (Sherry) Cai, Jianshe Feng, Jay Lee, University of Cincinnati, James Moyne, Jimmy Iskandar, Michael Armacost, Applied Materials 19033
1200pm Lunch Lunch

Majestic Ballroom A (Track A)
 Majestic Ballroom B (Track B)

SMART Manufacturing Session Continued
Chairs: Michael McIntyre, Rudolph Technologies, Merritt Funk, Tokyo Electron America
 Fault Detection Session Continued
Chairs: Alan Weber, Cimetrix, Richard Good, GLOBALFOUNDRIES
100pm APC, FDC, R2R and Smart Manufacturing in the Age of the Cloud and Big Data, Jim Redman, ErgoTech Systems 19012
 Overcoming Challenges in Root Cause Analysis with Trace Analytics, Jim Bird, NXP Semiconductors, KK Gan, Joe Lee, Mark Yelverton, BISTel 19034
130pm How to Leverage IIoT in Semi to Improve Process Performance, Andrew Wilson, Kevin Burns, Dan Hazen, MKS Instruments 19005
 Physics-Informed Machine Learning: Part 1 Methodology, Jun Kyu Lee, Abbas Emami-Naeini, Jon L. Ebert, Dick de Roover, La Moyne Porter, SC Solutions 19036
200pm Digital Twins for Yield: Analyzing Manufacturing Sensor and Process Data at Scale, Michael Alperin, Thomas Hill, Nico Rode, TIBCO Software 19007
 Physics-Informed Machine Learning: Part 2 Application to Wafer Temperature Estimation During Etch Processing, Jun Kyu Lee, Abbas Emami-Naeini, Jon L. Ebert, Dick de Roover, La Moyne Porter, SC Solutions 19037

Sensors and Equipment Session
Chairs: Michael McIntyre, Rudolph Technologies, Merritt Funk, Tokyo Electron America
 Fault Detection Session Continued
Chairs: Alan Weber, Cimetrix, Richard Good, GLOBALFOUNDRIES
230pm Sensor Integration for Cost Reduction and Scrap Avoidance, Yaniv Malachy, TowerJazz, Michael Neel, Christopher Bode, INFICON 19002 Equipment Trouble Prevention (ETP): An effective approach to Anomalous Equipment Trace Detection and Classification without Prior Labeling, Richard Burch, Jeffrey D. David, Qing Zhu, Tomonori Honda, Lin Lee Cheong, PDF Solutions 19038
300pm Coffee Break Coffee Break

Majestic Ballroom A (Track A) Majestic Ballroom B (Track B)

Sensors and Equipment Session Continued
Chairs: Doug Suerich, PEER Group, Robert J. Baseman, IBM Research
 Fault Detection Session Continued
Chairs: Abbas Emami, SC Solutions, Todd Nowalk, Applied Materials
330pm Deployment and operation of complex sensors in highly automated semi fabs - An approach towards Industry 4.0, Uwe Meissner, MKS Instruments 19003
 A practical example of the benefits of combining FDC results with advanced analytics to identify the actual root cause for poor etch rates, Michael McIntyre, Sophia Lin, Rudolph Technologies 19041
400pm Reducing Deep Milling Failure Analysis (FA) Turnaround Time (TAT) Using Inline Xe Plasma FIB and SEM Review Capabilities, Franz Niedermeier, Agnes Fros, Max Böckl, Infineon Technologies, Haim Pearl, Thomas Schubert, Allen Lee, Daniel Harel, Arie Bader, Jeffrey Dietz, Mirko Beyer, Wolfgang Bayerl, Applied Materials 19013
 Improving Time-To-Decision with AI in Semiconductor Manufacturing, Gabe Villareal, Joe Lee, Tom Ho, BISTel 19044
 Sensors and Equipment Session Continued
Chairs: Doug Suerich, PEER Group, Robert J. Baseman, IBM Research 		Standards Session
Chairs: Abbas Emami, SC Solutions, Todd Nowalk, Applied Materials
430pm SVM Learning for GFIS Trimer Health Monitoring in Helium-Neon Ion Beam Microscopy, Hsin-Yu Liu, Andrew B. Kahng, Lawrence Saul, University of California San Diego, Chris Park, Ramani Pichumani, Carl Zeiss SMT 19035
Semiconductor Smart Manufacturing: An Evolving Nexus of Business Drivers, Technologies, and Standards, Alan Weber, Cimetrix 19027
500pm This session ends at 500pm today
 Improvement of Recipe Security and Recipe Related Operations on SEMI E170 (SFORMS), Osamu Ohishi, IBM Services Japan 19008
530pm End Day 1 Track A Technical Sessions End Day 1 Track B Technical Sessions
530pm Reception, Exhibits, and Poster Sessions Reception, Exhibits, and Poster Sessions
700pm  APC Conference activities end for the day
  Reception sponsored by   SC Solutions logo 2016a
   

 Wednesday, October 30, 2019 Wednesday, October 30, 2019

Majestic Ballroom A (Track A) Majestic Ballroom B (Track B)

Keynote Session
Chairs: John Pace, James Moyne, Bradley Van Eck
830am Welcome
845am KEYNOTE: SMART Tools: Intelligent Controls in Semiconductor Manufacturing, Ben Rathsack, Tokyo Electron America 19043
930am The Potential of Smart Manufacturing to Increase Productivity and Efficiency, Thomas F. Edgar, University of Texas at Austin 19018
1000am The International Roadmap for Devices and Systems (IRDS) Factory Integration Roadmap for Smart Manufacturing, James Moyne, Applied Materials, Supika Mashiro, Tokyo Electron, Terry Cox, Bootstrap Ltd., Erik Collart, Edwards Vacuum, 19023  
1030am Coffee Break Coffee Break

 

 Analytics Session
Chairs: Mohamed Boumerzoug, NXP Semiconductors, Trent McKay, Seagate Technology
 Standards Session Continued
Chairs: Igor Tepermeister, INFICON, Christopher Bode, INFICON
1100am Applications of Graphical Gaussian Models for Process Control, Robert J. Baseman, Dzung Phan, Dhavalkumar C. Patel, Fateh A. Tipu, Jayant R. Kalagnanam, Tsuyoshi Ide, IBM Research 19022
Smart and Efficient Supply Chain Integration with SEMI Standards, Inna Skvortsova, SEMI 19011
1130am Leveraging the Benefits of Cloud Analytics in Semiconductor – A Real-time Application Case Study, Eric McCormick, Vinh Nguyen, Qorvo, Gabe Villareal, Joe Lee, Tom Ho, BISTel 19026
 Making Smart Manufacturing Work: Customer-Driven Requirements Development, Hanjoo Lee, SK Hynix, Alan Weber, Cimetrix 19040
1200pm Lunch Lunch

Majestic Ballroom A (Track A) Majestic Ballroom B (Track B)

Analytics Session Continued
Chairs: Mohamed Boumerzoug, NXP Semiconductors, Trent McKay, Seagate Technology
 Run-to-Run Session
Chairs: Igor Tepermeister, INFICON, Christopher Bode, INFICON
100pm Challenges and Opportunities for Analytics in Small Lot Processing Environments, Hemant Mungekar, Andreas Neuber, Sidharth Bhatia, Michael Johnson, Applied Materials 19017
 Recipe Management and Reduction for Multi-Chamber Deposition, Alex Echevarria, Hector Nevarez, Linlin Chen, Arif Choudury, Qorvo, Yulei Sun, Rudolph Technologies 19019

Leveraging Cross-Domain Applications Session
Chairs: Mohamed Boumerzoug, NXP Semiconductors, Trent McKay, Seagate Technology
 Run-to-Run Session Continued
Chairs: Igor Tepermeister, INFICON, Christopher Bode, INFICON
130pm Handling Data Sources, Velocity, and Volume for APC in Semiconductor Backend Assembly, Test, and Packaging, Todd Nowalk, Christopher Reeves, Applied Materials, Bill Pierson, Kx Systems 19029
 Run-to-run Control Modeling with Recurrent Neural Networks, Ivan Chen, SJ Wang, Ben Williams, Applied Materials 19028
200pm SEMI Standards to Support APC for Post-Fab Operations, Alan Weber, Cimetrix, Terry Asakawa, Vistaideal Consulting, Shekar Krishnaswamy, Ben Williams, Joe Napiah, Christopher Reeves, Applied Materials 19039Unit Manufacturing Process Models for Improved Performance Monitoring and Control of Resource Fleets in Manufacturing Systems, Efe C. Balta, Ilya Kovalenko, James Moyne, Dawn M. Tilbury, Kira Barton, University of Michigan 19031
230pm Integrating Subfab into Fab Automation for Smart Manufacturing, Jim L’Heureux, Andreas Neuber, Hemant P. Mungekar, Joseph van Gompel, Shaun Crawford, Applied Materials 19046
 R2R and FDC Case Studies for Deposition Processes in SAW Manufacturing, Niklaas Konopka, Stephane Vaissade, RF360 Europe GmbH, Joerg Reichelt, Yulei Sun, Rudolph Technologies 19015
300pm Coffee Break Coffee Break

Closing Session
Chairs: James Moyne, John Pace, Bradley Van Eck
330pm Using FDA And HIPAA Standards To Secure Equipment Performance Data, Sal Di Iorio, Revasum 19001
400pm A Framework for Adaptive Multivariate Limits Setting and Visualization in the Semi-automated Pattern-based Feature Extraction FD System, Jianshe Feng, Haoshu (Sherry) Cai, Jay Lee, University of Cincinnati, James Moyne, Jimmy Iskandar, Michael Armacost, Applied Materials, 19032
430pm Bringing Subject Matter Expertise and Analytics Together in Solutions for Microelectronics Smart Manufacturing: Consensus, Domains, and Approaches, James Moyne, Applied Materials 19042
500pm 2020 Announcement
 
530pm End Day 2 Track A Technical Sessions


630pm Banquet (sponsored by MKS)    MKS Logo_noTag
800pm APC Conference activities end for the evening


Posters (500-700pm Monday and 530-700pm Tuesday)

Reliability Improvement of Semiconductor Equipment Using Top-down System Approach, Young-gi An, Jae-seong Jeong, Korea Electronics Technology Institute 19006

SEMI Standards Guiding Smart and Secure Supply Chain Traceability, Inna Skvortsova, SEMI, David Huntley, PDF Solutions 19010

Integrated Measurement Association, John Pace, IMA 19021

The connected, sensorised subfab, and its contribution to Virtual Metrology, Erik Collart, Neil Condon, Edwards Ltd, Robert Wieland, Franz Wenninger, Fraunhofer EMFT 19025






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