March 2, 2017
March 3, 2017
Welcome to HPC4Manufacturing Industry Engagement Day “Spurring Innovation in U.S. Manufacturing Through Advanced Computing!”
World-class experts in their field have been gathered to reflect on the global trends of High Performance Computing (HPC) in manufacturing, describe why leading industry innovators have invested deeply in HPC and why others are primed to do so. Opportunities for access to capabilities that will allow for adoption of HPC will be presented, with opportunities for direct one-on-one engagement to discuss your specific needs and interests.
Don’t be left behind…be part of the conversation!
Lori Diachin, HPC4Mfg Program Director, LLNLPeg Folta, HPC4Mfg Industry Engagement Day Conference Chair, LLNL
Mark Johnson, AMO Director, DOE(on behalf of the Organizing Committee)
Join us following
Steam lines display the
interaction of the two main convective loops in the glass furnace that
form the critical spring zone. The temperature and velocity profiles at
the spring zone greatly influence the quality of the end product. Proper
control of the furnace parameters can significantly reduce the amount
of out-of-spec material that would need to be reworked and also reduce
wasted energy and the associated carbon emissions. The inset shows a
larger area of the tank and the two main flow loops.
Meeting Attire: Business Casual
Organizing Committee:Peg Folta, ChairLLNL: Lori Diachin, Jeff Roberts, Robin Miles, Stacy Castro, Loni Hoellwarth, Jess GroomORNL: John TurnerLBNL: Peter Nugent, David Skinner
If you are interested in becoming a sponsor for this conference, please contact Stacy Castro at 925-424-2797 or email@example.com.